Solutions Overview
Customized Solutions Break through the Limitations
Regardless of whether it's artificial intelligence, data analytics, or high-performance computing, memory bandwidth is a significant challenge in chip design. AP Memory's customized high-bandwidth memory solutions break through the limitations of data flow in chip design architecture. Combined with advanced 3D packaging technology, AP Memory not only enhances chip performance but also optimizes power efficiency, mitigating multiple challenges in high-performance chip design.
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All solutions
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VHMTM series
The world's first DRAM working with SoC through WoW 3D stacking technology.
S-SiCapTM Interposer IP
S-SiCapTM Interposer IP is customized to meet the demanding requirements of high-performance computing and AI applications.
Under Construction
Under Construction, No related information is available yet.