VHMTM uses WoW 3D stacking for leading bandwidth.
VHMTM
VHMTM is the world's first DRAM to leverage WoW 3D stacking technology, enabling industry-leading bandwidth and meeting the stringent demands of high-performance computing. With abundant connections between DRAM and SoC, VHMTM delivers over 4 TB/s per gigabyte density and excellent power efficiency. When fully utilized, the DRAM bandwidth can exceed 24 TB/s, significantly boosting your SoC's performance.
VHMStackTM
VHMStackTM is a multiple layers of VHMTM to provide scalable DRAM density to enhance SoC performance. AP Memory could provide different configuration or customization upon customer's requirement.
VHMInterposerTM
VHMInterposerTM combines VHMTM and a silicon interposer to deliver high-bandwidth memory and routing connections in a single die. With a DRAM density exceeding 1.2GB per 100mm2, VHMInterposerTM can also integrate S-SiCapTM to enhance SoC performance.
2022-06-30
AP Memory Joins the UCIe Industry Consortium to Promote AP Memory’s VHM™ and Contribute to Global Chiplet Ecosystem
The global leading customized memory solution provider AP Memory announces today to officially join the Universal Chiplet Interconnect Express (UCIe) industry consortium.
2021-08-24
AP Memory demonstrates VHMTM, the true 3D integration of DRAM and Logic
AP Memory announced successful demonstration of Very High-bandwidth Memory (VHMTM), the true 3D integration of DRAM and logic chips.
